Organic-based HDI packaging technology has enjoyed widespread use in various forms in recent
years. However, its effectiveness has been constrained by line and space limitations, restricted to
40 microns. The growing interest in chip-level disintegration or chiplets has underscored the
imperative for heightened levels of multichip integration and progressively smaller feature sizes
for PCBs. [...]
In part 1 of this article I asked whether “3D printer” is the best name for the category of machines that do 3D printing, additive manufacturing, or layered manufacturing. I concluded that “3D printing” and “3D printer” are adequate to describe today’s technology, which makes mostly parts, not products, and does so mostly by layering. [...]
I devoted a section of the first chapter of my book, 3D Printing Will Rock the World, to what I call “The Name Game.” My premise: “3D printing” is the best name for layered manufacturing. As I explained, the other contender, “additive manufacturing”, is inaccurate and overly broad, and just plain dull. [...]
