Fine Precision Interconnecting of Vias and Printed Circuit Boards (PCBs)
Precisely and accurately filling vias is a core process for the 3Dn Series, SVA Series, and SmartPump™ tool head.
Using the SmartPumpTM, the 3Dn and SVA Series provide extreme volumetric control to fill vias as small as 50 μm for manufacturing applications, and to fill ultra-high aspect ratio vias and freeform vias with complex geometries for electronic or thermal applications. Once the SmartPump™ has been digitally optimized for a specific material, no additional tuning is necessary for highly repeatable results through millions of pumping cycles.
With the nScrypt team’s know-how, you can form ultra-high aspect ratio vias and freeform vias with complex geometries for electronic or thermal applications.
