Solder Dispensing

The SVA platform is optimized for precision dispensing of solder dots as small as 50 microns, lines as narrow as small as 75 microns, and even complex patterns on diverse substrates and electronic devices. The platform’s SmartPump™ Microdispensing tool head can print virtually any solder alloys.

Adhesive dots 2x2 array

Precisely and accurately dispensing solder dots on diverse substrates and electronic devices is a core process for the 3Dn Series, SVA Series, and SmartPump™ tool head. The SVA Series is preconfigured and optimized for precision microdispensing of solder paste and other materials at speeds of 1500 or 3000 dots/hour. The SVA 3000 is a SMEMA standard tool for in-line production. This series is top of line for industrial manufacturing, consistently printing solder dots down to 50 μm , lines as narrow as small as 75 μm, and complex patterns on diverse substrates and electronic devices.