SVA Series
Specifications
The SVA Series is preconfigured for precision microdispensing of solder paste and adhesives, and for filling vias. The model numbers of this multi-function tool specify the adhesive/solder dots and via fillings per hour, 1500 or 3000. The SVA 3000 is a SMEMA standard tool for in-line production. This series is top of line for industrial manufacturing, consistently printing solder dots down to 50 microns, conductive traces down to 30 microns, and adhesives and dielectrics down to 75 microns. The SVA series can fill 25 micron diameter vias.
Features:
Up to 3000 solder dots and via fillings per hour
Consistently prints:
- Solder dots as small as 50μm (type 8 solder paste), 100-150μm (type 5-6)
- Conductive traces as small as 30μm (material dependent)
- Adhesives and dielectrics as small as 75μm
- Fills 25μm diameter vias
Gantry Platform with Linear Motors
- 300, 500, 750, 1000, 1500 mm Travel in XY
- Standard or High Precision (10nm resolution, 500nm repeatability, 1 micron accuracy)
- 150, 200 mm Travel in Z
Single, Dual, Tri, Quad and Penta-Head Options
- Micro-Dispensing
- 3D Printing (Material Extrusion)
- Laser Processing
- Pick and Place